Invention
Evolution
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We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

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AirCool® Prime,
AC3, AirCool®, HTU

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Thermal debonding solutions based on our patented AirCool® technology

Open
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Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
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Learn more about our technology, innovations and quality assurance.

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